January 16, 2021

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Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
Author : Hal Greenhouse
Publisher : William Andrew
Release Date : 2011
Category : Technology & Engineering
Total pages :348
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This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package�especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journals�or only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.

Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties
Author : Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
Publisher : CRC Press
Release Date : 1998-12-18
Category : Technology & Engineering
Total pages :128
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Hermeticity Testing of MEMS and Microelectronic Packages

Hermeticity Testing of MEMS and Microelectronic Packages
Author : Suzanne Costello,Marc P.Y. Desmulliez
Publisher : Artech House
Release Date : 2013-10-01
Category : Technology & Engineering
Total pages :200
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Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.

Area Array Interconnection Handbook

Area Array Interconnection Handbook
Author : Karl J. Puttlitz,Paul A. Totta
Publisher : Springer Science & Business Media
Release Date : 2012-12-06
Category : Technology & Engineering
Total pages :1188
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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Clinical Engineering

Clinical Engineering
Author : Yadin David,Wolf W. von Maltzahn,Michael R. Neuman,Joseph D. Bronzino
Publisher : CRC Press
Release Date : 2003-03-26
Category : Medical
Total pages :432
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A volume in the Principles and Applications in Engineering series, Clinical Engineering focuses on managing the deployment of medical technology and integrating it appropriately with desired clinical practices. It provides a description of the wide range of responsibilities clinical engineers encounter, describes technology management and assessment in detail, and reviews the standards and regulatory agencies of interest. Then the book details various biomedical sensors, considering both biologic and electronic factors in sensor performance. Finally, the book covers bioinstrumentation, addressing traditional topics and recently developed instruments and devices such as pulse oximeters and home-care monitoring devices.

Electronic Packaging and Production

Electronic Packaging and Production
Author : Anonim
Publisher : Unknown
Release Date : 1986
Category : Electronic apparatus and appliances
Total pages :129
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Advances in Electronic Packaging

Advances in Electronic Packaging
Author : Anonim
Publisher : Unknown
Release Date : 1997
Category : Electronic packaging
Total pages :129
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Electronic Materials Handbook

Electronic Materials Handbook
Author : Anonim
Publisher : ASM International
Release Date : 1989-11-01
Category : Technology & Engineering
Total pages :1224
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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Materials for High-Temperature Semiconductor Devices

Materials for High-Temperature Semiconductor Devices
Author : National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Temperature Semiconductor Devices
Publisher : National Academies Press
Release Date : 1995-10-14
Category : Technology & Engineering
Total pages :136
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Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Materials for High-Temperature Semiconductor Devices

Materials for High-Temperature Semiconductor Devices
Author : Committee on Materials for High-Temperature Semiconductor Devices,Commission on Engineering and Technical Systems,National Materials Advisory Board,Division on Engineering and Physical Sciences,National Research Council
Publisher : National Academies Press
Release Date : 1995-09-28
Category : Technology & Engineering
Total pages :115
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Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Hermeticity Testing of MEMS and Microelectronic Packages

Hermeticity Testing of MEMS and Microelectronic Packages
Author : Suzanne Costello,Marc P. Y. Desmulliez
Publisher : Unknown
Release Date : 2013
Category : Hermetic sealing
Total pages :195
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Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in.

Advanced Electronic Packaging

Advanced Electronic Packaging
Author : William D. Brown,Richard K. Ulrich
Publisher : Wiley-IEEE Press
Release Date : 2006-02-24
Category : Technology & Engineering
Total pages :812
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This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed. W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.

Microwave and Millimeter-Wave Electronic Packaging

Microwave and Millimeter-Wave Electronic Packaging
Author : Rick Sturdivant
Publisher : Artech House
Release Date : 2013-12-01
Category : Technology & Engineering
Total pages :261
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Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.

Electronic Packaging Materials Science III

Electronic Packaging Materials Science III
Author : Ralph Jaccodine,Kenneth A. Jackson,Robert C. Sundahl
Publisher : Unknown
Release Date : 1988
Category : Electronic packaging
Total pages :479
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Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author : Haleh Ardebili,Michael Pecht
Publisher : William Andrew
Release Date : 2009-07-22
Category : Technology & Engineering
Total pages :504
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Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Coverage of environmentally friendly 'green encapsulants' Practical coverage of faults and defects: how to analyze them and how to avoid them