January 25, 2021

Download Ebook Free Reliability And Failure Analysis Of High Power LED Packaging

Reliability and Failure Analysis of High Power LED Packaging

Reliability and Failure Analysis of High Power LED Packaging
Author : Cher Ming Tan,Preetpal Singh
Publisher : Woodhead Publishing
Release Date : 2021-08-15
Category : Technology & Engineering
Total pages :265
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Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide new insights for readers regarding the different possible failure mechanisms in high power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to a harsher stress conditions that high-power LEDs have to face. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high power LEDs under varying environmental conditions and methods of how to test, simulate and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high power LEDs

LED Packaging for Lighting Applications

LED Packaging for Lighting Applications
Author : Sheng Liu,Xiaobing Luo
Publisher : John Wiley & Sons
Release Date : 2011-07-05
Category : Technology & Engineering
Total pages :352
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"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

International Conference on Energy and Power Engineering (EPE2014)

International Conference on Energy and Power Engineering (EPE2014)
Author : Anonim
Publisher : DEStech Publications, Inc
Release Date : 2014-06-24
Category : Technology & Engineering
Total pages :470
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The 2014 International Conference on Energy and Power Engineering (EPE2014), will be held on April 26–27, 2014, in Hong Kong, China. The aim of this international convention is to bring together experts and scholars from around the world and offer them a chance to share the latest research results in the field of Energy and Power Engineering. We all know that over the past few decades, a great change has happened in the field of the environment technology, and the science technology is growing faster and faster. In order to keep up with the daily changing situation, we have sent invitations to experts, scholars and other people who have devoted himself in related fields, and it is a great honor to us that most of them have accepted our invitation and supported the EPE2014 with their latest studies. Up till now, we have received over three hundred papers from various countries; this shows that there has been a growing interest in the field of energy and power engineering. Among those papers received, we have eventually chosen about a hundred to be presented and included in this proceeding. These papers generally represented the current research status in this field and the future trend. We sincerely believe that these papers could be valuable to the future work of yours. Finally, on behalf of the committee, I would like to deeply express our gratitude to those who have supported the EPE2014, especially the international experts who helped reviewing papers, the DEStech Publications help publish the conference proceedings, and last but not least, the authors of these inspiring papers. Without the help from these people, EPE2014 would not be as half successful as it is now. Here, welcome to EPE2014 and let’s hope that it will be a great success. Tim Chou

Thermal Management for LED Applications

Thermal Management for LED Applications
Author : Clemens J.M. Lasance,András Poppe
Publisher : Springer Science & Business Media
Release Date : 2013-09-17
Category : Technology & Engineering
Total pages :551
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Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Solid State Lighting Reliability Part 2

Solid State Lighting Reliability Part 2
Author : Willem Dirk van Driel,Xuejun Fan,Guo Qi Zhang
Publisher : Springer
Release Date : 2017-08-13
Category : Technology & Engineering
Total pages :606
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In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Reliability Investigation of LED Devices for Public Light Applications

Reliability Investigation of LED Devices for Public Light Applications
Author : Raphael Baillot,Yannick Deshayes
Publisher : Elsevier
Release Date : 2017-03-09
Category : Technology & Engineering
Total pages :222
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Reliability Investigation of LED Devices for Public Light Applications focuses on state-of-the-art GaN-based LED technology through the study of typical failure mechanisms in public lighting applications. Across the different chapters, the reader will explore the tools and analyses involved in the study and application of a number of different LED devices. The authors review GaN-based LED technology by focusing on the main failure mechanisms targeting polymer-based packaging, thanks to electrical and spectral models. The proposed technology and methodologies will help those interested in the topic to further their knowledge of failure mechanisms, exploring the physical and chemical analyses involved. Based on the work of two main Phd results in 2011 and 2014 Describes GaN technology in the state-of-the-art, focusing on the specific electrical and spectral model Proposes the technology and methodologies to understand failure mechanisms

Solid State Lighting Reliability

Solid State Lighting Reliability
Author : W.D. van Driel,X.J. Fan
Publisher : Springer Science & Business Media
Release Date : 2012-09-06
Category : Technology & Engineering
Total pages :618
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Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Author : John Lau
Publisher : McGraw Hill Professional
Release Date : 2010-10-22
Category : Technology & Engineering
Total pages :560
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Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly
Author : Sheng Liu,Yong Liu
Publisher : John Wiley & Sons
Release Date : 2011-08-24
Category : Technology & Engineering
Total pages :288
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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Analysis of Solder Joint Reliability of High Power LEDs by Transient Thermal Testing and Transient Finite Element Simulations

Analysis of Solder Joint Reliability of High Power LEDs by Transient Thermal Testing and Transient Finite Element Simulations
Author : Anonim
Publisher : Unknown
Release Date : 2015
Category :
Total pages :129
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Abstract: An innovative sensitive test method is developed to detect solder joint cracking for high power LED packages. The method is based on transient thermal analysis and can fully replace the still dominating light-on test. For experimental application of the model, test groups of LED packages were soldered with two different lead free solders (SnAgCu305 and Innolot FL-640) on Aluminum Insulated Metal Substrate (Al-IMS) and exposed to temperature cycles. Transient thermal measurements were performed directly after assembly and after specific cycle numbers. After data processing the increase of the relative thermal resistance between the initial signal at "0" cycles and " n " cycles is obtained and correlated with cracks in the solder joint by cross sections. Based on the CAD and material data of the LED package a finite element (FE) model is set up. The time-resolved temperature curves are properly reproduced by transient thermal simulation. The measured "0" cycle curves are fitted using the FE model by adjusting a few material parameters within their allowed tolerance range. A parameter sensitivity analysis is performed. The impact of a crack in the solder joint between package and printed circuit board (PCB) on the time resolved temperature curve is simulated. The simulated crack propagates from the corner of the package to its center. The experimental measured curves are reproduced. Based on the simulation a failure criteria is defined, representing a crack length between 20% and 30% of the solder joint area, and Weibull curves are calculated. A higher creep resistance for the test group soldered with Innolot FL-640 compared to the test group soldered with SAC305 is observed.

International Conference on Solid State Lighting

International Conference on Solid State Lighting
Author : Anonim
Publisher : Unknown
Release Date : 2006
Category : Light emitting diodes
Total pages :129
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LED Lighting

LED Lighting
Author : T. Q. Khan,P. Bodrogi,Q. T. Vinh,H. Winkler
Publisher : John Wiley & Sons
Release Date : 2014-11-24
Category : Science
Total pages :520
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Promoting the design, application and evaluation of visually and electrically effective LED light sources and luminaires for general indoor lighting as well as outdoor and vehicle lighting, this book combines the knowledge of LED lighting technology with human perceptual aspects for lighting scientists and engineers. After an introduction to the human visual system and current radiometry, photometry and color science, the basics of LED chip and phosphor technology are described followed by specific issues of LED radiometry and the optical, thermal and electric modeling of LEDs. This is supplemented by the relevant practical issues of pulsed LEDs, remote phosphor LEDs and the aging of LED light sources. Relevant human visual aspects closely related to LED technology are described in detail for the photopic and the mesopic range of vision, including color rendering, binning, whiteness, Circadian issues, as well as flicker perception, brightness, visual performance, conspicuity and disability glare. The topic of LED luminaires is discussed in a separate chapter, including retrofit LED lamps, LED-based road and street luminaires and LED luminaires for museum and school lighting. Specific sections are devoted to the modularity of LED luminaires, their aging and the planning and evaluation methods of new LED installations. The whole is rounded off by a summary and a look towards future developments.

Manufacturing Process Technology

Manufacturing Process Technology
Author : Zheng Yi Jiang,Shan Qing Li,Jianmin Zeng,Xiaoping Liao,Dao Guo Yang
Publisher : Trans Tech Publications Ltd
Release Date : 2011-02-21
Category : Technology & Engineering
Total pages :4482
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This special volume aims to bring together the latest advances in, and applications of, surface engineering/coatings, modeling, analysis and simulation, materials forming, materials machining, welding and joining, laser-processing technology, casting and solidification, precision manufacturing technology and measurements, etc. It will not only furnish readers with a broad overview of the latest advances, but also provide a valuable summary and reference work for researchers in this field.

High-reliability Devices

High-reliability Devices
Author : RCA Corporation. Solid State Division
Publisher : Unknown
Release Date : 1973
Category : Integrated circuits
Total pages :129
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High Reliability Devices

High Reliability Devices
Author : Radio Corporation of America. Solid State Division
Publisher : Unknown
Release Date : 1973
Category : Electronic apparatus and appliances
Total pages :576
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