December 1, 2020

Download Ebook Free Reliability Characterisation Of Electrical And Electronic Systems

Reliability Characterisation of Electrical and Electronic Systems

Reliability Characterisation of Electrical and Electronic Systems
Author : Jonathan Swingler
Publisher : Elsevier
Release Date : 2014-12-24
Category : Technology & Engineering
Total pages :274
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This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices. The text describes the reliability behavior of electrical and electronic systems. It takes an empirical scientific approach to reliability engineering to facilitate a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation. After introducing the fundamentals and background to reliability theory, the text moves on to describe the methods of reliability analysis and charactersation across a wide range of applications. Takes a holistic approach to reliability engineering Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation

Reliability Characterisation of Electrical and Electronic Systems

Reliability Characterisation of Electrical and Electronic Systems
Author : Jonathan Swingler
Publisher : Woodhead Publishing
Release Date : 2020-11-15
Category : Technology & Engineering
Total pages :350
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The book charts how reliability engineering has moved from the use of sometimes arbitrary standards to an empirical scientific approach of understanding operating conditions, failure mechanisms, the need for testing for a more realistic characterisation and, new for the second edition, includes the monitoring of performance/robustness in the field. Reliability Characterisation of Electrical and Electronic Systems brings together a number of experts and key players in the discipline to concisely present the fundamentals and background to reliability theory, elaborate on the current thinking and developments behind reliability characterisation, and give a detailed account of emerging issues across a wide range of applications. The second edition has a new section titled Reliability Condition Monitoring and Prognostics for Specific Application which provides a guide to critical issues in key industrial sectors such as automotive and aerospace. There are also new chapters on areas of growing importance such as reliability methods in high-temperature electronics and reliability and testing of electric aircraft power systems. Reviews emerging areas of importance such as reliability methods in high-temperature electronics and reliability testing of electric vehicles Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing

Impedance Source Inverters

Impedance Source Inverters
Author : Hongpeng Liu,Zichao Zhou,Yuhao Li,Wentao Wu,Jiabao Jiang,Enda Shi
Publisher : Springer Nature
Release Date : 2020-01-13
Category : Technology & Engineering
Total pages :290
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This book focuses on impedance source inverters, discussing their classification, advantages, topologies, analysis methods, working mechanisms, improvements, reliability, and applications. It summarizes methods for suppressing DC-link voltage spikes and duty loss, which can pose a problem for researchers; and presents novel, efficient, steady state and transient analysis methods that are of significant practical value, along with specific calculation examples. Further, the book addresses the reliability of impedance source inverters, adopting a methodology from reliability engineering to do so. Given its scope, it offers a valuable resource for researchers, engineers, and graduate students in fields involving impedance source inverters and new energy sources.

Materials Characterization Using Nondestructive Evaluation (NDE) Methods

Materials Characterization Using Nondestructive Evaluation (NDE) Methods
Author : Gerhard Huebschen,Iris Altpeter,Ralf Tschuncky,Hans-Georg Herrmann
Publisher : Woodhead Publishing
Release Date : 2016-03-23
Category : Technology & Engineering
Total pages :320
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Materials Characterization Using Nondestructive Evaluation (NDE) Methods discusses NDT methods and how they are highly desirable for both long-term monitoring and short-term assessment of materials, providing crucial early warning that the fatigue life of a material has elapsed, thus helping to prevent service failures. Materials Characterization Using Nondestructive Evaluation (NDE) Methods gives an overview of established and new NDT techniques for the characterization of materials, with a focus on materials used in the automotive, aerospace, power plants, and infrastructure construction industries. Each chapter focuses on a different NDT technique and indicates the potential of the method by selected examples of applications. Methods covered include scanning and transmission electron microscopy, X-ray microtomography and diffraction, ultrasonic, electromagnetic, microwave, and hybrid techniques. The authors review both the determination of microstructure properties, including phase content and grain size, and the determination of mechanical properties, such as hardness, toughness, yield strength, texture, and residual stress. Gives an overview of established and new NDT techniques, including scanning and transmission electron microscopy, X-ray microtomography and diffraction, ultrasonic, electromagnetic, microwave, and hybrid techniques Reviews the determination of microstructural and mechanical properties Focuses on materials used in the automotive, aerospace, power plants, and infrastructure construction industries Serves as a highly desirable resource for both long-term monitoring and short-term assessment of materials

Prognostics and Health Management of Electronics

Prognostics and Health Management of Electronics
Author : Michael G. Pecht,Myeongsu Kang
Publisher : John Wiley & Sons
Release Date : 2018-08-21
Category : Technology & Engineering
Total pages :800
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An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.

Thermal Management of Electronic Systems II

Thermal Management of Electronic Systems II
Author : E. Beyne,C.J.M. Lasance,J. Berghmans
Publisher : Springer Science & Business Media
Release Date : 2012-12-06
Category : Technology & Engineering
Total pages :361
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For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices
Author : Milton Ohring,Lucian Kasprzak
Publisher : Academic Press
Release Date : 2014-11-03
Category : Technology & Engineering
Total pages :758
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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Reliability Control for Electronic Systems

Reliability Control for Electronic Systems
Author : Lacombe
Publisher : CRC Press
Release Date : 1999-05-14
Category : Technology & Engineering
Total pages :344
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Demonstrates how electronic products manufacturers can improve the effectiveness and longevity of their finished products, building in reliability at the design state and more efficiently monitoring and controlling it throughout practice. The text addresses management personnel in small- and medium-sized electronics manufacturing concerns.

Electronic Failure Analysis Handbook

Electronic Failure Analysis Handbook
Author : Perry L. Martin
Publisher : McGraw Hill Professional
Release Date : 1999
Category : Technology & Engineering
Total pages :520
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Offering top-to-bottom coverage of this rapidly developing field; this book encompasses breakthrough techniques and technologies for both components and systems reliability testing; performance evaluation; and liability avoidance. --

Safety and Reliability of Programmable Electronic Systems

Safety and Reliability of Programmable Electronic Systems
Author : Daniels
Publisher : Springer Science & Business Media
Release Date : 2012-12-06
Category : Juvenile Nonfiction
Total pages :270
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The use of programmable electronic systems (PES) in industry has grown considerably with the availability of microcomputers. These systems offer many benefits to the designer and user in providing more comprehensive control of industrial processes, enviroments, machine tools and in robot installations. As confidence grows with the application of PES, users and manufacturers are considering incorporating safety functions within the requirements and functions of the PES. This book represents the proceedings of the Programmable Electronic Systems Safety Symposium (PES-3) held in Guernsey, Channel Islands, May 28th - 30th 1986, which presented the guidance available to users, designers and safety assessors of programmable electronic systems. This guidance is applicable for many real and potential risk and safety situations in a wide variety of industries ranging from nuclear power plants and industrial robotics, to machine tools and chemical process controllers. The original impetus to hold the Symposium came from a two year collaborative project partially funded by the Commission of the European Communities under the 1979-83 Informatics Initiative. The sponsors of the Symposium studied the assessment, architecture and performance of industrial programmable electronic systems, with particular reference to robotics. The group of papers in the first session give the first public report of the results of this project. The session was Chaired by H Fangmeyer from the Commission's Joint Research Centre at Ispra, Italy, who was the Commission's Project Manager throughout the collaboration.

Reliability of Electronic Components

Reliability of Electronic Components
Author : Titu I. Bajenescu,Marius I. Bazu
Publisher : Springer Science & Business Media
Release Date : 2012-12-06
Category : Technology & Engineering
Total pages :509
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This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.

Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems

Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems
Author : Alhussein Albarbar,Canras Batunlu
Publisher : Springer
Release Date : 2017-07-19
Category : Technology & Engineering
Total pages :218
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This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.

Reliability Engineering

Reliability Engineering
Author : Alessandro Birolini
Publisher : Springer Science & Business Media
Release Date : 2007-08-15
Category : Technology & Engineering
Total pages :593
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This book presents the state-of-the-art of reliability engineering, both in theory and practice. It provides design guidelines for reliability, maintainability, and software quality. This is a textbook establishing a link between theory and practice, with a large number of tables, figures, and examples to support the practical aspects. This allows rapid access to practical results. The book is based on over 30 years of industrial and academic experience.

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author : Osamu Ueda,Stephen J. Pearton
Publisher : Springer Science & Business Media
Release Date : 2012-09-24
Category : Technology & Engineering
Total pages :616
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Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Failure Analysis

Failure Analysis
Author : Marius Bazu,Titu Bajenescu
Publisher : John Wiley & Sons
Release Date : 2011-03-08
Category : Technology & Engineering
Total pages :344
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Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.