November 29, 2020

Download Ebook Free Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Author : E-H Wong,Y.-W. Mai
Publisher : Woodhead Publishing
Release Date : 2015-05-23
Category : Technology & Engineering
Total pages :482
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Directed Self-assembly of Block Co-polymers for Nano-manufacturing

Directed Self-assembly of Block Co-polymers for Nano-manufacturing
Author : Roel Gronheid,Paul Nealey
Publisher : Woodhead Publishing
Release Date : 2015-07-17
Category : Technology & Engineering
Total pages :328
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The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
Author : Suryadevara Babu
Publisher : Woodhead Publishing
Release Date : 2016-01-09
Category : Technology & Engineering
Total pages :536
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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Rare Earth and Transition Metal Doping of Semiconductor Materials

Rare Earth and Transition Metal Doping of Semiconductor Materials
Author : Volkmar Dierolf,Ian Ferguson,John M Zavada
Publisher : Woodhead Publishing
Release Date : 2016-01-23
Category : Science
Total pages :470
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Rare Earth and Transition Metal Doping of Semiconductor Material explores traditional semiconductor devices that are based on control of the electron’s electric charge. This book looks at the semiconductor materials used for spintronics applications, in particular focusing on wide band-gap semiconductors doped with transition metals and rare earths. These materials are of particular commercial interest because their spin can be controlled at room temperature, a clear opposition to the most previous research on Gallium Arsenide, which allowed for control of spins at supercold temperatures. Part One of the book explains the theory of magnetism in semiconductors, while Part Two covers the growth of semiconductors for spintronics. Finally, Part Three looks at the characterization and properties of semiconductors for spintronics, with Part Four exploring the devices and the future direction of spintronics. Examines materials which are of commercial interest for producing smaller, faster, and more power-efficient computers and other devices Analyzes the theory behind magnetism in semiconductors and the growth of semiconductors for spintronics Details the properties of semiconductors for spintronics

Optical Interconnects for Data Centers

Optical Interconnects for Data Centers
Author : Tolga Tekin,Nikos Pleros,Richard Pitwon,Andreas Hakansson
Publisher : Woodhead Publishing
Release Date : 2016-11-01
Category : Computers
Total pages :428
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Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic

Proceedings 1998 International Symposium on Microelectronics

Proceedings 1998 International Symposium on Microelectronics
Author : James D. Welterlen,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers
Publisher : Society of Photo Optical
Release Date : 1998
Category : Technology & Engineering
Total pages :1046
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Proceedings of the ... International Symposium on Microelectronics

Proceedings of the ... International Symposium on Microelectronics
Author : Anonim
Publisher : Unknown
Release Date : 1998
Category : Hybrid integrated circuits
Total pages :129
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Hot Air Rises and Heat Sinks

Hot Air Rises and Heat Sinks
Author : Tony Kordyban
Publisher : Amer Society of Mechanical
Release Date : 1998-01-01
Category : Technology & Engineering
Total pages :223
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Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong is a collection of myths, mistakes, and "lessons learned" from practicing engineers involved in the field of electronic equipment cooling. Through anecdotes and stories based on his experiences at Tellabs Operations, Inc. Tony Kordyban covers basic dimensions of heat transfer concepts-mostly from real problems which were incorrectly solved at least once before a correct technique was applied. The book's 31 chapters, each on an important and relevant topic, contain simple line drawings to help illustrate the basic concepts, while the text provides accurate and complete technical explanations. The book's case study approach makes it an extremely useful and handy reference-and Kordyban's clear and entertaining writing style mixes technical subject matter with humor and is both interesting and instructive. Tony Kordyban is a thermal analysis specialist at Tellabs Operations, Inc., a billion dollar developer and supplier of telecommunications equipment. He has also worked in electronic packaging design and thermal analysis at Sola Electric and at Bell Labs.

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Author : Kim S. Siow
Publisher : Springer
Release Date : 2019-01-29
Category : Technology & Engineering
Total pages :279
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This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

1997 International Symposium on Microelectronics

1997 International Symposium on Microelectronics
Author : International Microelectronics and Packaging Society
Publisher : Society of Photo Optical
Release Date : 1997
Category : Technology & Engineering
Total pages :707
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Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).

The Science and Engineering of Materials

The Science and Engineering of Materials
Author : Donald R. Askeland,Frank Haddleton,Phil Green,Howard Robertson
Publisher : Springer
Release Date : 2013-11-11
Category : Technology & Engineering
Total pages :854
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The Science and Engineering of Materials, Third Edition, continues the general theme of the earlier editions in providing an understanding of the relationship between structure, processing, and properties of materials. This text is intended for use by students of engineering rather than materials, at first degree level who have completed prerequisites in chemistry, physics, and mathematics. The author assumes these stu dents will have had little or no exposure to engineering sciences such as statics, dynamics, and mechanics. The material presented here admittedly cannot and should not be covered in a one-semester course. By selecting the appropriate topics, however, the instructor can emphasise metals, provide a general overview of materials, concentrate on mechani cal behaviour, or focus on physical properties. Additionally, the text provides the student with a useful reference for accompanying courses in manufacturing, design, or materials selection. In an introductory, survey text such as this, complex and comprehensive design problems cannot be realistically introduced because materials design and selection rely on many factors that come later in the student's curriculum. To introduce the student to elements of design, however, more than 100 examples dealing with materials selection and design considerations are included in this edition.

Plastic Packaging of Microelectronic Devices

Plastic Packaging of Microelectronic Devices
Author : Louis T. Manzione
Publisher : Van Nostrand Reinhold Company
Release Date : 1990
Category : Technology & Engineering
Total pages :377
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Next Generation HALT and HASS

Next Generation HALT and HASS
Author : Kirk A. Gray,John J. Paschkewitz
Publisher : John Wiley & Sons
Release Date : 2016-03-11
Category : Technology & Engineering
Total pages :296
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Next Generation HALT and HASS presents a major paradigm shift from reliability prediction-based methods to discovery of electronic systems reliability risks. This is achieved by integrating highly accelerated life test (HALT) and highly accelerated stress screen (HASS) into a physics-of-failure-based robust product and process development methodology. The new methodologies challenge misleading and sometimes costly mis-application of probabilistic failure prediction methods (FPM) and provide a new deterministic map for reliability development. The authors clearly explain the new approach with a logical progression of problem statement and solutions. The book helps engineers employ HALT and HASS by illustrating why the misleading assumptions used for FPM are invalid. Next, the application of HALT and HASS empirical discovery methods to quickly find unreliable elements in electronics systems gives readers practical insight to the techniques. The physics of HALT and HASS methodologies are highlighted, illustrating how they uncover and isolate software failures due to hardware-software interactions in digital systems. The use of empirical operational stress limits for the development of future tools and reliability discriminators is described. Key features: * Provides a clear basis for moving from statistical reliability prediction models to practical methods of insuring and improving reliability. * Challenges existing failure prediction methodologies by highlighting their limitations using real field data. * Explains a practical approach to why and how HALT and HASS are applied to electronics and electromechanical systems. * Presents opportunities to develop reliability test discriminators for prognostics using empirical stress limits. * Guides engineers and managers on the benefits of the deterministic and more efficient methods of HALT and HASS. * Integrates the empirical limit discovery methods of HALT and HASS into a physics of failure based robust product and process development process.

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author : Günter Grossmann,Christian Zardini
Publisher : Springer Science & Business Media
Release Date : 2011-05-12
Category : Technology & Engineering
Total pages :313
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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

High Temperature Electronics

High Temperature Electronics
Author : F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski
Publisher : CRC Press
Release Date : 2018-05-04
Category : Technology & Engineering
Total pages :352
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The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.